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Part Number |
Manufacturers
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Desc
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In Stock
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Packing
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Rfq |
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Intel |
780 Terminations0°C~100°C TJ System On ChipArria 10 SX Series 360 I/O0.9V
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262 |
780-BBGA, FCBGA |
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Xilinx Inc. |
676 Terminations-40°C~100°C TJ XC7Z045 System On ChipZynq?-7000 Series 130 I/O1V
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480 |
676-BBGA, FCBGA |
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Xilinx Inc. |
0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 204 I/O
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440 |
900-BBGA, FCBGA |
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Microsemi Corporation |
536 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 293 I/O1.2V
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143 |
536-LFBGA, CSPBGA |
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Xilinx Inc. |
625 Terminations-40°C~125°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 128 I/O0.85V
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195 |
625-BFBGA, FCBGA |
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Xilinx Inc. |
900 Terminations0°C~100°C TJ System On ChipZynq?-7000 Series 130 I/O1V Min 950mV VMax 1.05V V
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199 |
900-BBGA, FCBGA |
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Xilinx Inc. |
784 Terminations-40°C~125°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 128 I/O0.85V
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332 |
784-BFBGA, FCBGA |
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Xilinx Inc. |
-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EV Series 252 I/O
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385 |
784-BFBGA, FCBGA |
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Xilinx Inc. |
625 Terminations0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 180 I/O0.72V
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798 |
625-BFBGA, FCBGA |
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Xilinx Inc. |
0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 328 I/O
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711 |
1156-BBGA, FCBGA |
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Xilinx Inc. |
0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EV Series 252 I/O
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818 |
784-BFBGA, FCBGA |
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Microsemi Corporation |
0°C~85°C TJ M2S050 System On ChipSmartFusion?2 Series 267 I/O
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601 |
484-BGA |
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Microsemi Corporation |
400 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 207 I/O1.2V
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774 |
400-LFBGA |
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Microsemi Corporation |
400 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 207 I/O1.2V
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723 |
400-LFBGA |
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Microsemi Corporation |
400 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 207 I/O1.2V
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471 |
400-LFBGA |
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Microsemi Corporation |
400 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 207 I/O1.2V
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911 |
400-LFBGA |
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Microsemi Corporation |
0°C~85°C TJ 400 Pin M2S050T System On ChipSmartFusion?2 Series 207 I/O
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520 |
400-LFBGA |
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Microsemi Corporation |
484 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
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883 |
484-BGA |
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Microsemi Corporation |
-40°C~125°C TJ System On ChipAutomotive, AEC-Q100, SmartFusion?2 Series 207 I/O
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401 |
400-LFBGA |
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Microsemi Corporation |
400 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 207 I/O1.2V
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591 |
400-LFBGA |
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Microsemi Corporation |
484 Terminations-55°C~125°C TJ System On ChipSmartFusion?2 Series 233 I/O1.2V
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331 |
484-BGA |
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Microsemi Corporation |
484 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
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684 |
484-BGA |
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Microsemi Corporation |
400 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 207 I/O1.2V
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300 |
400-LFBGA |
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Microsemi Corporation |
400 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 207 I/O1.2V
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780 |
400-LFBGA |
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Microsemi Corporation |
676 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 387 I/O1.2V
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665 |
676-BGA |
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Microsemi Corporation |
484 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
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188 |
484-BGA |
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Microsemi Corporation |
400 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 207 I/O1.2V
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560 |
400-LFBGA |
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Microsemi Corporation |
-40°C~100°C TJ M2S050T System On ChipSmartFusion?2 Series 267 I/O
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108 |
484-BGA |
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Microsemi Corporation |
0°C~85°C TJ System On ChipSmartFusion?2 Series 207 I/O
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942 |
400-LFBGA |
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Microsemi Corporation |
0°C~85°C TJ M2S050T System On ChipSmartFusion?2 Series 267 I/O
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703 |
484-BGA |
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